Design and Simulation

Solve design rendering and simulation problems in different computing scenarios and with different data forms

High Performance Computing

Provide high-performance, high-computing power cluster solutions

AI training and inference

Professional AI solutions for efficient AI-powered office work

High-frequency financial trading

Integrated solution, building high-frequency trading computing power base

Storage

Resolve I/O performance read/write bottlenecks and ensure high reliability and data security

Data centers and cloud computing

Provide comprehensive liquid cooling solutions from the entire cabinet to the data center

GPU server

Solve design simulation problems for different computing scenarios and data formats

Universal server

Solve design simulation problems for different computing scenarios and data formats

Xinchuang Products

Solve design simulation problems for different computing scenarios and data formats

Liquid cooled products

Solve design simulation problems for different computing scenarios and data formats

Software

Solve design simulation problems for different computing scenarios and data formats

Solution

liquid-cooled workstation

Solution

With the extreme pursuit of computing performance in applications such as AI large model training, rendering, and scientific computing, traditional cooling methods have become insufficient to support the stable and quiet operation of high-performance hardware. Our integrated liquid-cooled workstation, specifically designed for high-load scenarios, achieves full coverage liquid cooling for CPUs and GPUs, allowing your computing platform to perform efficiently and coolly at all times.

Overview of the Plan
Pain points in scenarios
Technical Solution
Application scenarios
Advantages and value of the scheme

Pain points in scenarios

The cooling capacity of air cooling is limited

Air-cooled workstations face heat dissipation issues, making it difficult to meet high-density computing demands, and are prone to local hot spots and thermal bottlenecks.

The cooling capacity of air cooling is limited

Huge noise

The air-cooled workstation, when operating at full capacity, generates significant noise, directly affecting the working environment, professional creation, and the atmosphere of scientific research and office work.

Huge noise

There is a bottleneck in performance

When the core temperature exceeds the CPU/GPU safety threshold and air cooling fails to provide adequate heat dissipation, it can trigger the hardware protection mechanism, which reduces frequency to minimize heat generation, ultimately leading to a decline in computing performance.

There is a bottleneck in performance

Long-term high temperature accelerates hardware aging

Continuous high temperatures can shorten the lifespan of components such as capacitors and inductors, increasing the risk of motherboard failure; graphics card memory particles may cause "screen distortion" or data errors under high temperatures.

Long-term high temperature accelerates hardware aging
The cooling capacity of air cooling is limited
Huge noise
There is a bottleneck in performance
Long-term high temperature accelerates hardware aging

Technical Solution

The liquid cooling solution significantly enhances the computing power density and stability of AI training clusters through efficient heat dissipation technology, reducing energy consumption and operation and maintenance costs. It employs direct or indirect contact cooling methods to provide precise temperature control for high-load GPU/ASIC chips, facilitating the construction of green and low-carbon AI computing power centers.

Technical Solution

The liquid cooling solution, utilizing efficient liquid cooling technology, significantly enhances the cooling efficiency and power-to-performance ratio of chips in AI training scenarios, ensuring stable computing power output under high loads, while reducing energy consumption and carbon footprint.

The liquid cooling solution addresses the high thermal density challenge posed by GPU/ASIC chips in AI training scenarios. Utilizing liquid as the cooling medium, it achieves a heat dissipation efficiency 3-5 times higher than traditional air cooling through designs such as cold plate immersion (direct contact) or cold plate type (indirect contact). This enables the chip operating temperature to be controlled within the optimal range, thereby avoiding computing power throttling (frequency reduction).
This solution supports a PUE (Power Usage Effectiveness) reduction to below 1.1, saving 30%-50% of cooling energy consumption. It is compatible with cluster deployment, meets the cooling requirements of kilocalorie-level AI training servers, provides continuous and stable computing power support for large-scale model training, and reduces the carbon footprint of data centers. Typical applications include LLM training, autonomous driving simulation, and other high-intensity computing scenarios.

Application scenarios

The liquid cooling solution provides efficient cooling support for high-computing-power scenarios such as AI training, 3D rendering, and scientific computing, significantly enhancing hardware performance and energy efficiency ratio, reducing PUE, and facilitating the construction of green data centers. Its modular design flexibly adapts to GPU/CPU clusters, covering enterprise-level applications such as gene detection and financial modeling, ensuring stable operation under high load for extended periods, while reducing operation and maintenance costs and carbon footprint.

Artificial intelligence and deep learning training platform

Artificial intelligence and deep learning training platform

3D modeling/rendering and film post-production

3D modeling/rendering and film post-production

Scientific computation, genetic testing, financial modeling

Scientific computation, genetic testing, financial modeling

High-load data analysis/simulation environment

High-load data analysis/simulation environment

High-end enterprise IT and workgroup applications

High-end enterprise IT and workgroup applications

Advantages and value of the scheme

Advantages and value of the scheme

Fully-covered integrated liquid cooling architecture

Fully-covered integrated liquid cooling architecture

The CPU and multi-channel GPU are cooled through a liquid cooling system, with all core heat sources integrated into the water circuit, effectively reducing temperature and ensuring stable and worry-free performance under full load. It is compatible with mainstream high-end hardware such as NVIDIA/AMD/Intel.

Ultimate heat dissipation, ultra-low noise

Ultimate heat dissipation, ultra-low noise

The full-load operating temperature is far superior to that of air cooling/separate water cooling, and the silent experience is almost noiseless, creating a quiet and efficient atmosphere for professional creation and scientific research and office work.

Integrated design, easy to maintain

Integrated design, easy to maintain

Precision integrated water cooling structure, with no exposed pipelines, short and reliable water circuit, effectively avoids liquid leakage and reduces maintenance difficulty. Modular design makes cold liquid replacement and maintenance faster and more convenient.

Green energy saving, intelligent temperature control

Green energy saving, intelligent temperature control

Intelligently adjusts cooling power consumption to avoid energy waste. Compared to traditional cooling solutions, it significantly improves energy efficiency, helping enterprises achieve their "carbon neutrality" goals.

Support customization and flexible expansion

Support customization and flexible expansion

Meeting multiple application scenarios such as AI research, rendering, simulation, and data analysis, the integrated liquid cooling solution supports multi-card parallel processing and cluster deployment, with customized exclusive configurations on demand.

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Focused on intelligent computing solutions

Professional consulting services with patient troubleshooting

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400-869-9865

Email:business@linkupai.cn

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